Automatic loading system

Country:
Austria

Client:
Semiconductor industry

Background:
The trends in the semiconductor industry are towards ever larger and thinner wafers that are often only tenths to a few hundredths of a millimetre thick. As ordinary machines are no longer suitable for handling such extremely thin, fragile wafers, they will have to be adapted to meet the new demands. Up to now processing has therefore been carried out manually by highly qualified personnel with special tools. Uniform quality and higher throughput rates in fabrication were the key demands that prompted the start of development for suitable handling technology. The aim was to develop a machine that can localise and handle the extremely thin, fragile and warped wafers.

CTR services:
CTR was responsible for the entire development chain – from the initial feasibility studies, the design of special gripper systems, development of high precision sensor systems to the finished prototype and product. The main challenge was that precision, cleanness and reliability take top priority throughout the entire process in the semiconductor industry. Following preliminary studies and tests, it became apparent that these demands called for special grippers to be developed using a combination of compressed air and vacuum. This technology even enables wafers under tension to be handled safely. A perfectly synchronized robotic system ensures that the machine functions properly. Higher-level logistics coordinate the processes inside the machine and the environment in the clean room. The machine is controlled by a system of modular microcontrollers and PCs. The users are equipped with portable input devices linked by radio network for transmitting all the data required for operation. Design and manufacture of the automatic loading system was carried out by PTS Austria Production Technology Systems.

Project duration:
2 years

Project scope:
Technology monitoring, development of sensor-guided robotic systems and special pickup technologies