Feasibility study for automatic wax bonding

Country:
Austria

Client:
E+E Elektronik GmbH

Background:
E+E Elektronik GmbH in Upper Austria manufactures humidity and air velocity sensors and transducers using thin-film technology. Thin glass substrates have to be sawn for the individual sensors. This involves bonding the substrates to a glass base with wax, a process that is currently performed manually for the most part. The aim is to automate the process also improving the quality of the bonding at the same. The wax layer should be as thin and homogenous as possible without any bubbles. In addition, it is important to prevent the sensor surface from being contaminated with residual wax as far as possible.

CTR services:
Feasibility study: development of different solutions (spray process and bond stamp), evaluation with laboratory apparatus and tests, conception of a machine. A continuation of the project to build the machine was agreed.

Project duration:
5 Months

Project scope:
Feasibility study