- Multiphysics/Co-Simulation of 3D integrated “More-than-Moore” systems e.g. to reduce cross-sensitivity; identify hot spots for improved functionality.
- Packaging research for sensors and MEMS involves the optimization of the mechanical and electrical interface specific to the application, especially high temperature environments.
- Packaging and Integration for smart systems is the specific integration of miniaturized sensors in existing products realizing a smart system.
- Research on ink-jet and 3D printing technologies leading to maskless and customizable deposition on wafer/chip/package level and rapid prototyping packages
The Heterogeneous Integration Technologies team involves interdisciplinary competences of material science, microsystems technologies, physics, mechatronics as well as fluid and structural FEM simulation experts. Like the challenges in the field of packaging and integration are multidisciplinary so the team reflects the necessary competences. The HIT area has access to a 100m2 C8 clean room at the premises with state of the art packaging equipment, which is constantly enhanced according to project demand. In addition novel ink-jet printing technologies together with photonic curing equipment is available for the research of additive manufacturing technologies in the context of packaging and assembly.
- Packaging and µ-assembly
- Die bond (Adhesive bonding, Transient liquid phase bonding, Nano-particle sinter bonding, Flip-Chip)
- Wire bond (Wedge /wedge (Al, Au, Pt, Ag))
- Multi-physics simulation (Co-Simulation): Thermo-mechanical simulation, Magnetic simulation, CFD simulation
- Additive Manufacturing (3D and Ink-jet print): Printing of polymer package prototypes, Ink-jet di-electric / metallization schemes
- Characterization & Test: Environmental testing, Bond characterization, MSA characterization