Today’s manufacturers produce wafers in state-of-the-art facilities and bake them on huge trays. Their quality not only depends on the recipe but also physical baking parameters such as pressure and temperature. It is these parameters that the new smart baking tray can now detect even while the wafers are baking.
The project centred on developing wireless surface acoustic wave (SAW) sensors capable of transmitting several parameters reliably and without any errors: each individual baking tray’s temperature, pressure and identification. What was a particular challenge was the extremely hot baking temperature of up to 180°C and measuring the pressure without affecting the shape of the wafers. The successful development is a global innovation, as there is no published evidence of combined SAW pressure and temperature sensors that can be used at such high baking temperatures. We have filed a patent for the sensor system.